1. General two pads a little resistance capacitance, usually 0603 and 0805 is a point.

2.SMT processing a triode-1.5 points.

3. small four-PIN SOP for a point, giant three PIN IC for one point, BGA according to the density of the solder ball 3 ball to a point, some manufacturers 2 solder balls for a point.

Agreed with 4.SMT processing of special components.