|
Item
|
Unit
|
Process Capability (sample)
|
Process Capability (Production)
|
|
Surface Treatment
|
/
|
Tin lead /Leadfree HASL、Flash Gold、ENIG、OSP、Immersion Tin / Silver、Hard Gold
|
Tin lead /Leadfree HASL、Flash Gold、ENIG、OSP、Immersion Tin / Silver、Hard Gold
|
|
Selective Surface Treatment
|
/
|
ENIG+OSP，ENIG+Gold Finger，Gold Finger+HASL，Flash Gold+Gold Finger，Immersion Silver+Gold Finger，Immersion Tin+Gold Finger
|
ENIG+OSP，ENIG+Gold Finger，Gold Finger+HASL，Flash Gold+Gold Finger，Immersion Silver+Gold Finger，Immersion Tin+Gold Finger
|
|
Layer Count
|
Layer
|
0-30(≥26 Layers needs Review）
|
0-12(≥10 Layers needs Review）
|
|
Bow and Twist
|
%
|
0.75(≤0.5needs Process Review）
|
0.75(≤0.5needs Process Review）
|
|
Min finished size
|
mm
|
10*10mm
|
Need panel
|
|
Max finished Size (≥4L)
|
mm
|
610*1200mm
|
500*600mm
|
|
Multi-press for Blind/Buried Vias
|
/
|
Multi-press Cycle≤4 times(Needs review for 2 cycles pressing)
|
Multi-press Cycle≤2times
|
|
Max finished Size (Double Sides)
|
mm
|
610*1500mm
|
610*900mm
|
|
Finished Board Thickness
|
mm
|
0.20-7.0(≤0.2mm Needs Review),≤0.4mm for HASL
|
0.20-7.0(≤0.2mm Needs Review),≤0.4mm for HASL
|
|
Finished Board Thickness Tolerance(≤1.0mm)
|
mm
|
±0.1
|
±0.1
|
|
Finished Board Thickness Tolerance(>1.0mm)
|
mm
|
Material Thickness±8%
|
Material Thickness±10%
|
|
Unspecified Finished Board Thickness Tolerance（No stack up requirements）
|
mm
|
Multilayer：≤2.0mm can±0.1；2.0-3.0mm can±0.15；≥3.0mm can±0.2；Double Sides+/-10%
|
Multilayer：≤2.0mm can±0.1；2.0-3.0mm can±0.15；≥3.0mm can±0.2；Double Sides+/-10%
|
|
Peel Strength
|
N/cm
|
7.8
|
7.8
|
|
Flammability
|
|
94V-0
|
94V-0
|
|
Ionic Contamination
|
ug/cm2
|
≤1
|
≤1
|
|
Min Dielectric Thickness
|
mm
|
0.075(only for HOZ Base Copper) / 1OZ if copper ground area >80%
|
0.075(only for HOZ Base Copper) / 1OZ if copper ground area >80%
|
|
Impedance Tolerance
|
%
|
±5Ω(<50Ω),±10%(≥50Ω);≥50Ω±5%（Needs Review）
|
±5Ω(<50Ω),±10%(≥50Ω);≥50Ω±5%（Needs Review）
|
|
High Tg Material
|
|
Shengyi Tg>170℃; ITEQ 180; KV6168
|
Shengyi Tg>170℃; ITEQ 180; KV6168
|
|
Impedance Control Material
|
Others need Review
|
FR-4,FR-4 HighTg Series
|
FR-4,FR-4 HighTg Series
|
|
RCC Material
|
Needs Review
|
Copper foil thickness 12um,Dielectric Thickness 65,80,100um (After Pressing 55,70,90um)
|
Copper foil thickness 12um,Dielectric Thickness 65,80,100um (After Pressing 55,70,90um)
|
|
FR-4 Prepreg、LD-1080（HDI）
|
|
7628 2116 1080 3313 106
|
7628 2116 1080 3313 106
|
|
Copper Foil
|
um
|
12、18、35、70、105、140
|
12、18、35、70、105 (Use 70UM base copper，After plating 105UM)
|
|
Scrubbing Machine
|
|
0.11-3.2mm,min 9*9inch
|
0.11-3.2mm,min 9*9inch
|
|
laminator, Exposer
|
|
0.11-6.0mm,min 8*8in,max 24*24in
|
0.11-6.0mm,min 8*8in,max 24*24in
|
|
Etching Line
|
|
0.11-6.0mm,min 7*7inch
|
0.2-6.0mm,min 7*7inch
|
|
Min Inner Line Width(18um copper foil,Before Compensation)
|
mil
|
3.2
|
4
|
|
Min Inner Line Spacing(18um base copper,after compensation)
|
mil
|
3.2
|
4
|
|
Min Inner Line Width(35um copper foil,Before Compensation)
|
mil
|
4
|
4
|
|
Min Inner Line Spacing(35um base copper,after compensation)
|
mil
|
4
|
4
|
|
Min Inner Line Width(70um copper foil,Before Compensation)
|
mil
|
6
|
7
|
|
Min Inner Line Spacing(70um base copper,after compensation)
|
mil
|
6
|
7
|
|
Min Inner Line Width(105um copper foil,Before Compensation)
|
mil
|
10
|
10
|
|
Min Inner Line Spacing(105um base copper,after compensation)
|
mil
|
8
|
10
|
|
Min Inner Line Width(140um copper foil,Before Compensation)
|
mil
|
12
|
14
|
|
Min Inner Line Spacing(140um base copper,after compensation)
|
mil
|
10
|
14
|
|
Min Spacing from hole edge to conductive
|
mil
|
≤6L 6.5mil（Partial 7mil）、≤12L 10mil（Partial 9mil)
|
≤6L 8mil（Partial 7mil）、≤12L 10mil（Partial 9mil)
|
|
Min Innerlayer Annular Ring
|
mil
|
3(18,35um,Partial3.5),6(70um),8(105um)
|
5(18,35um,Partial3.5),7(70um),10(105um)
|
|
Min Innerlayer Isolation Clearance
|
mil
|
Conductive to Conductive 10mil(Partial 8mil)
|
Conductive to Conductive 12mil(Partial 8mil)
|
|
Min Spacing from board edge to conductive
|
mil
|
8（except for blind vias）、10（Blind Vias）
|
10（except for blind vias）、12（Blind Vias）
|
|
Min Gap width between copper ground
|
mil
|
5(35um base copper) ≥2pcs （≥70um needs review)
|
8(35um base copper) ≥2pcs （≥70um needs review)
|
|
Different copper thckness for inner core
|
um
|
18/35,35/70(needs review）
|
18/35,35/70(needs review）
|
|
Max Finished Copper Thickness
|
oz
|
10OZ(175um)、≥6OZ needs review
|
4OZ(140um)
|
|
Min Outer Line Width(6-9um base copper，before compensation)
|
mil
|
3(achieve copper Thickness25um-30um)
|
3.2(achieve copper Thickness25um-30um)
|
|
Min Outer Line Spacing(6-9um base copper, after compensation)
|
mil
|
3
|
3.2
|
|
Min Outer Line Width(12um base copper，before compensation)
|
mil
|
3(achieve copper Thickness30um-35um)
|
3.5(achieve copper Thickness30um-35um)
|
|
Min Outer Line Spacing(12um base copper, after compensation)
|
mil
|
3
|
3.5
|
|
Min Outer Line Width(18um base copper，before compensation)
|
mil
|
4.5
|
4.5
|
|
Min Outer Line Spacing(18um base copper, after compensation)
|
mil
|
3.5
|
4
|
|
Min Outer Line Width(35um base copper，before compensation)
|
mil
|
5.0
|
5.0
|
|
Min Outer Line Spacing(35um base copper, after compensation)
|
mil
|
4
|
5
|
|
Min Outer Line Width(70um base copper，before compensation)
|
mil
|
7.0
|
7.0
|
|
Min Outer Line Spacing(70um base copper, after compensation)
|
mil
|
4.0
|
6.0
|
|
Spacing from Line to pad, pad to pad (After compensation)
|
mil
|
3.5(12um)，4.0(18um、35um),5.5(70um),6.5(105、140um)
|
4(12um)，4.0(18um、35um),5.5(70um),6.5(105、140um)
|
|
Min Outer Line Width(105um base copper，before compensation)
|
mil
|
9.0
|
12.0
|
|
Min Outer Line Spacing(105um base copper, after compensation)
|
mil
|
6.0
|
12.0
|
|
Min Outer Line Width(140um base copper，before compensation)
|
mil
|
12.0
|
16.0
|
|
Min Outer Line Spacing(140um base copper, after compensation)
|
mil
|
12.0
|
16.0
|
|
Min Grid Line Width
|
mil
|
5（12、18、35 um），8（70 um）
|
5（12、18、35 um），10（70 um）
|
|
Min Grid Spacing
|
mil
|
5（12、18、35 um），8（70 um）
|
5（12、18、35 um），10（70 um）
|
|
Min Hole Pad Diameter
|
mil
|
12(0.10mm mechanical or Laser Drill)
|
12(0.10mm mechanical or Laser Drill)
|
|
Max size for slot tenting
|
|
5mm*3.0mm；the tent land should >10mil
|
5mm*3.0mm；the tent land should >10mil
|
|
Max diameter for tenting hole
|
mm
|
4.5
|
4.5
|
|
Min tent land width
|
mil
|
6
|
6
|
|
Min annular ring（after compensation, except for blind vias）
|
mil
|
4(12、18um) Partial 3.5、4.5(35um)、 6(70um)、8(105um)、10（140um）
|
4(12、18um) 、5(35um)、 6(70um)、8(105um)、10（140um）
|
|
Min BGA diamter
|
mil
|
10(Flash gold 8mil)
|
10(Flash gold 8mil)
|
|
Orbotech SK-75 AOI
|
/
|
0.05-6.0mm,max 23.5*23.5inch
|
0.05-6.0mm,max 23.5*23.5inch
|
|
Orbotech Ves Machine
|
/
|
0.05-6.0mm,max 23.5*23.5inch
|
0.05-6.0mm,max 23.5*23.5inch
|
|
Dis covery 8200 AOI
|
/
|
0.05-7.7mm,max26*31inch
|
0.05-7.7mm,max26*31inch
|
|
NTL-DG2H\NTL-DG6H Drill machine
|
can process 2nd drill
|
0.11-6.0mm，max size 22.4*26inch min Drill ￠0.15MM
|
0.11-6.0mm，max size 22.4*26inch min Drill ￠0.15MM
|
|
MT-CNC2600 Drill machine
|
can process 2nd drill
|
0.11-6.0mm，max size 18.5*26inch min Drill ￠0.20MM
|
0.11-6.0mm，max size 18.5*26inch min Drill ￠0.20MM
|
|
Min slot drill bit size
|
mm
|
0.5
|
0.5
|
|
Max aspect ratio for board thickness vs drill bit size
|
/
|
12:1(except for ≤0.2mm drill bit,exceed 10:1 needs review)
|
12:1(except for ≤0.2mm drill bit,exceed 10:1 needs review)
|
|
Hole location tolerance（Compare with CAD data）
|
mil
|
±3
|
±3
|
|
Counterbore hole
|
|
PTH & NPTH，Top angle 130 Degree，Top diameter <6.3mm
|
PTH & NPTH，Top angle 130 Degree，Top diameter <6.3mm
|
|
Min spacing from hole edge to conductive(Except for blind vias)
|
mil
|
6(≤8 L),7(≤10 L),8(≤14 L),12(≤26 L)
|
6(≤8 L),7(≤10 L),8(≤14 L),12(≤26 L)
|
|
Max drill bit size
|
mm
|
6.3
|
6.3
|
|
Max board thickness for 0.20mm drill bit size
|
mm
|
2.5
|
2
|
|
Min multi-hit slot width
|
mm
|
0.45
|
0.45
|
|
Hole size tolerance for press fit
|
mil
|
±2
|
±2
|
|
Min PTH Slot dimension tolerance
|
mm
|
±0.15
|
±0.15
|
|
Min NPTH slot dimension tolerance
|
mm
|
±0.05
|
±0.05
|
|
Min spacing from hole edge to conductive(Blind vias)
|
mil
|
8(1 cycle pressing) 10(2 cycles pressing) 12(3 cycles pressing)
|
8(1 cycle pressing) 10(2 cycles pressing) 12(3 cycles pressing)
|
|
Max board thickness for 0.15mm mechanical drill
|
mm
|
1.35(≤8 L) needs review
|
1.2(≤8 L) needs review
|
|
Min hole size for laser drill
|
mm
|
0.10(Depth ≤55um),0.13(Depth ≤80um，0.15(Depth ≤100um)
|
0.10(Depth ≤55um),0.13(Depth ≤80um，0.15(Depth ≤100um)
|
|
Countersink hole angle & Diameter
|
|
Top 82，90，120 degree， diameter≤10mm needs review
|
Top 82，90，120 degree， diameter≤10mm needs review
|
|
Panel & Pattern plating line
|
|
0.20-7.0mm,max 24*30inch
|
0.20-7.0mm,max 24*30inch
|
|
Deburring Maching
|
|
0.20-7.0mm,min 8*8inch
|
0.20-7.0mm,min 8*8inch
|
|
Desmear Line
|
Can process 2nd desmear
|
0.20-7.0mm,max 24*32in
|
0.20-7.0mm,max 24*32in
|
|
Tin Plating Line
|
|
0.20-3.2mm,max 24*30inch
|
0.20-3.2mm,max 24*30inch
|
|
Min hole wall copper thickness
|
um
|
average 25,min≥20
|
average 25,min≥20
|
|
Finished copper thickness(12um base copper)
|
um
|
≥25
|
≥18
|
|
Finished copper thickness(18um base copper)
|
um
|
≥35(nominal thickness 52um、or 1.5Oz)
|
≥35(nominal thickness 52um、or 1.5Oz)
|
|
Finished copper thickness(35um base copper)
|
um
|
≥50(nominal thickness 65um)
|
≥50(nominal thickness 65um)
|
|
Finished copper thickness(70um base copper)
|
um
|
≥85
|
≥85
|
|
Min Line width for ectching marking
|
mil
|
8(12、18um)，10(35um)，12（70um）
|
8(12、18um)，10(35um)，12（70um）
|
|
Max finished copper thickness for inner & Outer layers
|
/
|
1OZ(350um)、≥6OZ needs review
|
1OZ(350um)、≥6OZ needs review
|
|
Different copper thickness
|
/
|
18/35、35/70(needs review)
|
18/35、35/70(needs review)
|
|
Scrubbing Machine
|
/
|
0.50-7.0mm,min：9*9inch
|
0.50-7.0mm,min：9*9inch
|
|
Exposer
|
/
|
0.11-7.0mm,max 25*32inch
|
0.11-7.0mm,max 25*32inch
|
|
Develop Machine
|
/
|
0.11-7.0mm,min 4*5inch
|
0.11-7.0mm,min 4*5inch
|
|
Solder Mask Color
|
/
|
Green, yellow, black, blue, red, white, matte green
|
Green, yellow, black, blue, red, white, matte green
|
|
silkscreen Color
|
/
|
White,yellow,black,orange,gray
|
White,yellow,black,orange,gray
|
|
Min Solder Mask Opening（Clearance）(After Compensation)
|
mil
|
2mil(Partial 1.5 for Flash Gold,others can partia 1mil)Only for18um & 35um
|
2mil(Partial 1.5 for Flash Gold,others can partia 1mil)Only for18um & 35um
|
|
Max plugged vias size
|
mm
|
0.65mm for drill bit size
|
0.5mm for drill bit size
|
|
Min width for line coverage by S/M
|
mil
|
2mil per side,Only applies to 18um and 35um base copper
|
2mil per side,Only applies to 18um and 35um base copper
|
|
Min solder mask legends width
|
